Today we discovered an Android phone benchmark recognized as the Sony H8266 in the repository of mobile benchmarking service AnTuTu, with its expected features merging it in the flagship sector of the handset industry. The device which is prone to release as part of Sony’s key Xperia product is supported by the Snapdragon 845, the utmost competent system-on-chip created by Qualcomm, sticking with the same chunk of silicon being anticipated to power a large number of high-end Android phones which are prepared to be launched in 2018. The top end processor is supported by 4GB of RAM and 64GB of inbuilt storage, most likely extended via a microSD card, as outlined by the benchmark. The similar detailing shows that the Sony H8266 will feature a large 18:9 screen panel with a Full HD plus resolution with 2160×1080 pixels. The handset thus won’t likely to be Sony’s major top-class handset presenting in 2018 and probably will not be an immediate successor to the Xperia XZ Premium whose device series has only included 4K phones for many years now.
Image courtesy: Weibo
As an alternative, the Sony H8266 will be promoted as a better reachable flagship for folks who intend to negotiate on display screen fidelity so as to spend less money yet count on high-quality performance from their budget devices. Although Sony’s Mirai style version was formerly suspected to be maintaining the 16:9 aspect ratio regardless of fewer bezels, the H8266 possibly won’t totally adopt it or else older reports regarding the topic happen to be erroneous. Most of the records indicate that the recently benchmarked device is going to be a handset that accompanies most of the hottest industry advancements, such as an elongated image layout and comparatively small bezels. The smartphone was benchmarked whilst operating on Android 8.0 Oreo, most likely enriched with Sony’s featherweight software suite. Based on earlier leaks, the Sony H8266 is going to include a 3,240mAh battery under the hood with Qnovo Adaptive Charging Aid and IP68-certified dust particles and water protection. Although the Japanese Original Equipment Manufacturer will probably introduce the H8266 at 2018 Mobile World Congress in February, their selling isn’t anticipated to be out before mid-2018 because of its System on Chip preference.